PCB & PCBA Manufacturer
PCB Material Options
FR-4 (Standard Rigid PCB Material)
FR-4 is a flame-retardant epoxy fiberglass laminate and is the most widely used material for rigid PCBs.
“Tg130” indicates a glass transition temperature of 130°C, meaning the material begins to soften above this temperature.
FR-4 is ideal for:
Standard electronics
Prototypes and mass production
Most consumer and industrial applications
The prepreg and core layers of standard rigid PCBs are made from FR-4.
High-TG FR-4 (TG155)
High-TG FR-4 offers improved thermal stability and can withstand temperatures up to 155°C.
It is recommended for:
Multilayer PCBs
High-temperature environments
Lead-free soldering processes
Flexible PCB (Flex Circuits)
Flexible PCBs are manufactured using polyimide as the base material.
They are thin, lightweight, and bendable, making them ideal for compact and dynamic products such as:
Wearable devices
Cameras
Foldable electronics
Medical and consumer electronics
Flex PCBs enable space-saving designs and improve reliability in moving or vibrating assemblies.
Aluminum PCB (Metal Core PCB)
Aluminum-backed PCBs are designed for excellent heat dissipation and mechanical stability.
Compared to FR-4, aluminum PCBs offer:
Lower thermal resistance
Better dimensional stability
Longer product lifetime
They are widely used in:
LED lighting
Automotive lighting
Traffic signals
Power electronics
Aluminum PCB Capabilities
| Parameter | Specification |
|---|---|
| Layers | 1 Layer |
| Min Slot Width | 1.6 mm |
| Min Drill Size | 1.0 mm |
| PCB Colors | White, Black |
| Thickness | 1.0 / 1.2 / 1.6 mm |
| Board Size | 5 × 5 mm to 480 × 580 mm |
| Breakdown Voltage | 3000 V |
| Thermal Conductivity | 1 W/m·K |
| Copper Weight | 1 oz |
| Surface Finish | HASL (Lead / Lead-Free) |
| Testing | 100% AOI + Random Flying Probe |
| Lead Time | Same as 1-layer FR-4 |
| Panelization | V-cut |
| Min Trace / Space | 5 mil (0.127 mm) |
| Trace to Outline | ≥ 0.4 mm |
Copper Core PCB (Direct Heatsink Technology)
Copper core PCBs use a solid copper base as a built-in heatsink.
This allows heat to be transferred directly from the component into the copper, without passing through a thermal insulation layer.
Compared to aluminum PCBs, copper core PCBs provide:
Significantly lower thermal resistance
Faster heat dissipation
Better reliability for high-power components
They are ideal for:
COB LEDs
Power regulators
High-current and high-power electronics
Copper PCB Design Rules
Direct heatsink pads must be rectangular or polygonal
Minimum pad width: 1 mm
Heatsink pads must not connect to standard pads or traces
If traces are required, they must also be designed as direct heatsink (raised copper) traces
Technical limits:
Vias are not supported
FR-4 holes are not plated
Minimum drill size: 1.0 mm
Minimum slot width: 1.6 mm
Surface finish: OSP
Panelization: V-cut only
Rogers PCB (High-Frequency & RF)
Rogers laminates are high-performance materials designed for RF, microwave, and high-speed digital circuits.
They offer:
Low dielectric loss
Stable impedance
Excellent signal integrity
Typical applications include:
5G equipment
RF modules
Microwave communication systems
High-speed networking
PTFE / Teflon PCB
PTFE (Teflon) PCBs provide exceptional electrical and thermal performance and are used in the most demanding environments.
They are ideal for:
Ultra-high-frequency circuits
Aerospace and defense electronics
Precision RF and microwave systems
Key benefits:
Extremely low dielectric constant
Excellent heat resistance
Superior signal stability at high frequencies
