1 Layer to 12 Layer FR4 PCB – Standard & Custom Stackup

1 Layer to 12 Layer FR4 PCB – single-sided to complex multilayer
1 layer – simplest design, lowest cost
2 layer – most common for simple products, double-sided components
4 layer – best balance of cost & performance (ground + power planes)
6 layer – more routing space, better EMI control
8 layer – high density, complex routing
10 layer / 12 layer – advanced designs, maximum routing density
Standard stackups – proven, cost-effective layer arrangements
Custom stackups – tailored to your impedance & thickness requirements
100% electrical test – ISO9001 & UL certified

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1 Layer to 12 Layer FR4 PCB – Standard & Custom Stackup

Not every PCB requires 12 layers. The right layer count depends on your routing density, signal integrity requirements, EMI sensitivity, and budget.

We manufacture FR4 PCBs from 1 layer to 12 layers, offering both standard stackups (proven, cost-effective) and custom stackups (tailored to your specific impedance, thickness, and performance requirements).

Choose the right layer count for your project – without paying for capabilities you don’t need.

Layer Count Selection Guide

Layer Count	Common Name	Typical Applications	Key Characteristics
1 Layer	Single-sided	Remotes, keypads, simple sensors, LED indicators	Lowest cost, components on one side
2 Layer	Double-sided	Most consumer electronics, power supplies, Arduinos	Components both sides, low cost
4 Layer	Multilayer	Industrial controls, IoT devices, automotive modules	Ground + power planes, better EMI
6 Layer	Multilayer	Telecom, networking, medical devices	More routing, better signal integrity
8 Layer	High density	ADAS, high-end industrial, FPGAs	Complex routing, dense BGAs
10 Layer	High density	High-end telecom, servers, advanced computing	Maximum routing density
12 Layer	Very high density	High-speed digital, aerospace, defense	Extreme density, multiple power domains

What is a Stackup?

A stackup defines the arrangement of copper and insulating layers in a multilayer PCB. It specifies:

Element	What It Defines
Layer order	Which layers are signal, ground, power
Dielectric thickness	Distance between copper layers (affects impedance)
Copper weight	Thickness of copper on each layer
Material type	FR4 grade (Standard TG or High TG 170°C)
Total board thickness	Sum of all layers + prepregs + cores

Standard stackups – Pre-designed, proven arrangements. Lower cost, faster turnaround.
Custom stackups – Designed for your specific impedance, thickness, or performance requirements.

Standard Stackups (Proven & Cost-Effective)

We offer standard stackups for common layer counts. These are pre-optimized for manufacturability and cost:

1 Layer (Single-sided) – Standard Stackup

Layer	Function	Thickness
L1 (Top)	Signal + Components	1 oz copper
Substrate	FR4	0.6mm – 2.4mm
L2 (Bottom)	No copper (single-sided)	–

2 Layer – Standard Stackup

Layer	Function	Thickness
L1 (Top)	Signal + Components	1 oz copper
Substrate	FR4 Core	1.6mm (typical)
L2 (Bottom)	Signal + Components	1 oz copper

4 Layer – Standard Stackup (Most Common)

Layer	Function	Thickness
L1 (Top)	Signal	1 oz copper
Prepreg	2116	~0.12mm
L2 (Ground)	Ground Plane	1 oz copper
Core	FR4 Core	~1.1mm
L3 (Power)	Power Plane	1 oz copper
Prepreg	2116	~0.12mm
L4 (Bottom)	Signal	1 oz copper
Total		~1.6mm

6 Layer – Standard Stackup

Layer	Function	Thickness
L1 (Top)	Signal	1 oz
Prepreg	1080	~0.07mm
L2 (Ground)	Ground	1 oz
Core	FR4 Core	~0.2mm
L3 (Signal)	Signal (Inner)	1 oz
Prepreg	2116	~0.12mm
L4 (Power)	Power	1 oz
Core	FR4 Core	~0.8mm
L5 (Ground)	Ground	1 oz
Prepreg	1080	~0.07mm
L6 (Bottom)	Signal	1 oz
Total		~1.6mm

8 Layer / 10 Layer / 12 Layer – Standard Stackups

Available upon request. We provide stackup drawings during DFM review.

Custom Stackups

When standard stackups don’t meet your requirements, we design custom stackups for:

Requirement	Custom Stackup Solution
Controlled impedance (50Ω/90Ω/100Ω)	Adjust dielectric thickness and trace width
Specific board thickness (e.g., 1.0mm, 2.0mm)	Custom core/prepreg selection
Specific copper weight on inner layers	2-4 oz on power planes
Asymmetric stackups	Different thickness above/below center
Blind / buried vias	Additional lamination cycles
High TG material (170°C+)	Premium FR4 grade

We provide custom stackup design free of charge with your order – specify your requirements.

Standard vs. Custom Stackup Comparison

Feature	Standard Stackup	Custom Stackup
Design time	None – pre-designed	We design for you (included)
Tooling cost	None	None for reasonable volumes
Lead time	Fastest (stock materials)	+2-5 days (material selection)
Cost	Lowest (standard materials)	+10-30% (non-standard materials)
Impedance control	Possible within standard thicknesses	Optimized for your target
Best for	Most applications	Impedance control, special thickness

Recommendation: Use standard stackups unless you have specific impedance or thickness requirements.

1 Layer vs. 2 Layer vs. 4 Layer vs. 6+ Layer – Quick Comparison

Feature	1 Layer	2 Layer	4 Layer	6+ Layer
Routing layers	1	2	2 (with reference planes)	4+
Ground plane	No (copper pour)	No (copper pour)	Yes – dedicated	Yes – multiple
Power distribution	Traces	Traces	Dedicated power plane	Multiple power planes
EMI performance	Poor	Poor	Good	Excellent
Impedance control	Not recommended	Difficult	Practical	Excellent
Component density	Low	Medium	High	Very high
Relative cost	Baseline	+20-30%	+50-80%	+100-300%
Best for	Simplest products	General purpose	Most commercial products	High-speed, dense designs

Technical Specifications by Layer Count

Parameter	1-2 Layer	4 Layer	6 Layer	8-12 Layer
Min trace width	6 mil (4 mil avail)	4 mil	4 mil	4 mil (3 mil avail)
Min drill size	0.25mm	0.20mm	0.20mm	0.20mm
Copper weight	1-4 oz	1-4 oz	1-4 oz	1-2 oz (inner typical)
Board thickness	0.6-2.4mm	0.8-2.4mm	1.0-2.4mm	1.2-2.4mm
Typical lead time (prototype)	3-5 days	5-7 days	7-10 days	7-12 days
Controlled impedance	Not recommended	Yes	Yes	Yes
Blind/buried vias	No	No	Limited	Yes

How to Choose the Right Layer Count

Question	Answer → Recommended Layers
Simple circuit with few components?	→ 1 or 2 layer
Need good EMI performance?	→ 4 layer minimum
Have BGA or fine-pitch components?	→ 4 layer minimum (6+ for dense BGAs)
Need controlled impedance (USB/Ethernet)?	→ 4 layer minimum
Routing is very tight on 4 layers?	→ 6 layer
Multiple high-speed interfaces?	→ 6 or 8 layer
Maximum routing density, many BGAs?	→ 8, 10, or 12 layer
Cost is primary constraint?	→ Lowest possible that works (2 or 4 layer typical)

Applications by Layer Count

Layer Count	Typical Applications
1 layer	Remote controls, keypads, simple sensors, LED indicator boards
2 layer	Power supplies, Arduino shields, basic consumer electronics, relay boards
4 layer	Industrial controls, IoT devices, automotive modules, medical monitors
6 layer	Telecom equipment, networking, medical devices, automotive ECUs
8 layer	ADAS, FPGAs, high-end industrial, servers
10-12 layer	High-end telecom, advanced computing, aerospace, defense

Why Manufacture Your FR4 PCB With Us (1-12 Layers)?

Feature	What You Get
Full range	1 layer to 12 layers – all in one place
Standard stackups	Proven, cost-effective, fast turnaround
Custom stackups	Free design for impedance or thickness requirements
Free DFM review	We verify stackup works with your design
Layer count recommendation	Not sure? We help you choose
ISO9001 & UL certified	Quality and safety certified
100% electrical test	Every board tested

Order Process

Upload Gerber files – specify layer count and stackup (standard or custom)
Free DFM review – we verify stackup compatibility
Stackup drawing provided – for custom stackups
Fabrication – per your specifications
100% electrical test
Secure shipping

Not sure which layer count? Send us your design files and requirements. We recommend the optimal layer count free of charge.

Q1: How do I choose between 2, 4, and 6 layers?

Layer Count	Choose if…
2 layer	Simple design, low speed (<10 MHz), no EMI concerns, cost is critical
4 layer	Need good EMI, have ground/power planes, moderate speed, controlled impedance needed
6 layer	4 layers are too tight for routing, need better signal isolation, multiple high-speed interfaces

Most commercial products use 4 layers. Start there unless you have specific reasons for 2 or 6+.

Q2: What is a standard stackup? Do I need to design my own?

A: Standard stackup is a pre-designed layer arrangement (e.g., Signal-Ground-Power-Signal for 4-layer). We provide proven standard stackups for each layer count.

Need	Action
Standard stackup is fine	No action – we use default
Need custom stackup	Specify: impedance targets, board thickness, copper weight

We design custom stackups free of charge. You don’t need to design your own unless you have specialized knowledge.

Q3: Can I mix different copper weights on different layers?

A: Yes. Common examples:

Inner power planes: 2 oz (power distribution)
Outer signal layers: 1 oz (fine traces)
Outer power layers: 2-4 oz (high current)

Specify copper weight per layer when ordering.

Q4: What is the cost difference between layer counts?

A: Approximate cost increase vs. 2-layer (same board size, prototype quantity):

Layer Count	Cost Increase (approx.)
1 layer	-10-20% (less than 2-layer)
2 layer	Baseline (100%)
4 layer	+50-80%
6 layer	+100-150%
8 layer	+150-250%
10-12 layer	+250-400%

Recommendation: Use the lowest layer count that meets your requirements. Each additional layer adds significant cost.

Q5: What is the thickest board possible with 12 layers?

A: Maximum thickness depends on layer count and copper weight:

Layer Count	Max Thickness (approx.)
2-4 layer	2.4mm
6-8 layer	2.4mm
10-12 layer	2.0mm (due to many thin layers + total thickness limits)

For thicker requirements, discuss with our engineers during quoting.

Q6: Can I do controlled impedance on 2-layer boards?

A: Not recommended. 2-layer boards lack a dedicated ground plane adjacent to signals, causing inconsistent reference. For controlled impedance (USB, Ethernet, RF), use 4 layers minimum.

Q7: What is the typical lead time for different layer counts?

Layer Count	Prototype (1-20 pcs)	Production (100-1000 pcs)
1-2 layer	3-5 days	7-10 days
4 layer	5-7 days	8-12 days
6 layer	7-10 days	10-14 days
8-12 layer	7-12 days	12-18 days

Higher layer counts require more lamination cycles → longer lead times.

Q8: Do you support blind or buried vias on 8+ layer boards?

A: Yes. For 8+ layer boards:

Blind vias – connect outer layer to inner layer (not through entire board)
Buried vias – connect inner layers only (not visible from outside)
Sequential lamination – required for blind/buried vias (adds 2-5 days, 20-40% cost)

Specify blind/buried via requirements when ordering.

Q9: How do I get a stackup drawing for my design?

A: We provide free stackup drawings for every custom stackup order. What we need:

Layer count
Target impedance (if any)
Preferred board thickness (or we recommend)
Copper weight per layer

Within 24 hours of receiving your requirements, we provide a detailed stackup drawing for approval.

Q10: What if I don’t know which layer count I need?

A: Send us your design files (Gerber or PCB design files). Our engineers review your:

Component density (especially BGA count and pitch)
Routing complexity
Signal speed requirements

We recommend the optimal layer count free of charge – no obligation to order.

Shipping Terms

Shipping costs are paid by the buyer.
We normally ship via DHL, UPS, FedEx, or TNT.
Alternatively, you may provide your own courier account or arrange delivery to your freight forwarder in China.

For large-volume orders, sea freight is available.

Delivery to Port (FOB Terms)

When shipping to a port, Tengxinjie is responsible for transporting the goods to the departure port.
All customs clearance, ocean freight, insurance, and onward transportation after that point are the responsibility of the buyer.

Tengxinjie can recommend reliable local freight forwarders upon request.
With the buyer’s authorization, Tengxinjie may also assist in coordinating shipping, with all related costs charged to the buyer.

Notice

The above shipping information is for reference only.
Tracking details and shipment updates will be provided once the order has been dispatched.

PCBA Shipping Delivery

Tags:1 Layer to 12 Layer FR4 PCB 4 layer stackup 6 layer PCB stackup Custom Stackup PCB Double sided PCB FR4 PCB High layer count PCB multilayer PCB PCB stackup design Single Sided PCB Standard Stackup PCB

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1 Layer to 12 Layer FR4 PCB – Standard & Custom Stackup