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Bendable Circuit Board – Flex Printed Circuit Solution | Manufacturer

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Bendable Circuit Board – Flex Printed Circuit Solution

  • Bendable Circuit Board – flex printed circuit solution

  • Bends to fit any shape – curved enclosures, tight spaces, irregular forms

  • RA copper standard – rolled annealed for reliable bending

  • Ultra-thin construction – 0.1mm to 0.4mm total thickness

  • Static or dynamic bending – one-time assembly or repeated flexing

  • Eliminates connectors – replaces rigid board + cable assemblies

  • Lightweight – no heavy FR4 material in bend areas

  • Custom layer count – 1 to 4 layers (6 on request)

  • No MOQ for prototypes – order as few as 5 pieces

  • ISO9001 & UL certified – quality you can trust

  • Product Details
  • FAQs
  • Shipping & Delivery

Bendable Circuit Board – Flex Printed Circuit Solution

bendable circuit board (also known as a flexible printed circuit or FPC) is designed to bend, fold, and conform to shapes that rigid PCBs cannot achieve. Unlike rigid boards that crack or break when stressed, bendable circuit boards use thin polyimide material and rolled annealed (RA) copper to flex without damage.

Whether you need a static bend (one-time assembly, then fixed in place) or dynamic flexing (repeated bending over thousands of cycles), our flex printed circuit solution delivers reliable performance.

What is a Bendable Circuit Board?

FeatureRigid PCBBendable Circuit Board
MaterialFR4 (glass epoxy)Polyimide (Kapton)
Thickness0.6-2.4mm0.1-0.4mm
BendabilityNone – cracks if bentYes – designed to bend
Copper typeED copper (standard)RA copper (rolled annealed)
Typical applicationsStandard electronicsCurved enclosures, tight spaces, moving parts

Static Bend vs. Dynamic Bend

FeatureStatic BendDynamic Bend
Bending frequencyOnce (during assembly)Repeated (thousands of cycles)
Bend radius≥10x thickness≥30x thickness
Copper typeRA or EDRA copper required
Typical applicationsFolded into enclosureHinge, moving arm, flexing cable

Bendable Circuit Board Construction

LayerMaterialThicknessFunction
Coverlay (top)Polyimide0.5 milProtection for copper traces
Copper L1RA copper, 0.5-1 oz0.7-1.4 milSignal traces
AdhesiveAcrylic0.5-1 milBonding
Polyimide coreDuPont Kapton1-2 milBase insulation
AdhesiveAcrylic0.5-1 milBonding
Copper L2RA copper, 0.5-1 oz0.7-1.4 milGround / power
Coverlay (bottom)Polyimide0.5 milProtection
Total thickness~0.1-0.4mm

Why RA Copper for Bendable Circuits?

Copper TypeGrain StructureBendabilityBest For
ED copper (electro-deposited)Columnar grains – cracks along boundariesPoorStatic only (limited)
RA copper (rolled annealed)Horizontal grains – cracks less likelyExcellentAll bendable circuits

We use RA copper as standard – you don’t need to request it.

Bend Radius Guidelines

Flex ThicknessStatic Bend (one-time)Dynamic Bend (repeated)
0.1mm (1 layer)1mm (10x)3mm (30x)
0.15mm (2 layer)1.5mm4.5mm
0.2mm (2 layer thick)2mm6mm
0.3mm (4 layer)3mm9mm
0.4mm (4 layer thick)4mm12mm

Larger bend radius = longer life. For dynamic bending, always use ≥30x thickness.

Technical Specifications for Bendable Circuit Boards

ParameterOur Capability
Layer count1 to 4 layers (6 on request)
Board thickness0.1mm to 0.4mm
Copper weight0.5 oz or 1 oz
Copper typeRA copper standard (rolled annealed)
Min trace width/spacing3 mil / 3 mil (0.075mm)
Min drill size0.15mm mechanical, 0.10mm laser
Bend radius (static)≥10x thickness
Bend radius (dynamic)≥30x thickness
Coverlay materialPolyimide (yellow or black)
Coverlay thickness0.5 mil or 1 mil
Surface finishENIG (preferred), HASL, Immersion Silver
StiffenersFR4, polyimide, or metal (where needed)

Design Guidelines for Bendable Circuits

Design ElementRecommendationWhy
Bend radiusAs large as possibleLarger radius = less stress
Trace directionPerpendicular to bend axisMinimizes stress on traces
Trace widthConsistent – no necking in bend areaNarrow points concentrate stress
Via placementNo vias in bend areaVias crack when bent
Copper weight0.5 oz preferredThinner copper bends better
CoverlayPolyimide coverlay (not solder mask)Coverlay flexes, mask cracks
Stiffener edgeTapered or step-cutPrevents stress concentration
Flex lengthAllow extra length (slack)Prevents tension at endpoints
ShieldingUse flexible shielding (not solid copper)Solid copper restricts bending

Applications for Bendable Circuit Boards

ApplicationBend TypeWhy Bendable Circuit is Required
Laptop hingeDynamicConnects motherboard to display through hinge
Foldable phoneStatic (folds flat)Folds with the display
Wearable fitness bandDynamicConforms to wrist movement
Medical endoscopeStatic (assembly)Bends through body cavity
Robotic armDynamicContinuous flexing at joints
Camera moduleStaticFolds into compact housing
Automotive folding mirrorDynamicFlexes when mirror folds
Printhead / scannerDynamic (sliding)Repeated flexing as head moves
Hearing aidStaticConforms to custom ear shape

Bendable Circuit vs. Rigid PCB + Cable

ApproachComponentsConnectionsReliabilitySpace
Rigid PCB + Cable2 PCBs + 2 connectors + 1 cable3 connectionsModerate (connectors fail)Wastes space
Bendable Circuit Board1 continuous board0 connectionsExcellentTight / curved

Bendable Circuit vs. Standard Flex – What’s the Difference?

TermSame Product?Notes
Bendable Circuit BoardYesEmphasizes the bending capability
Flexible Printed Circuit (FPC)YesTechnical industry term
Flex Circuit BoardYesCommon shortened form
Flex PCBYesVery common abbreviation

All refer to the same technology. We use them interchangeably.

Why Choose Our Bendable Circuit Board Solution?

FeatureWhat You Get
RA copper standardWithstands static and dynamic bending
Ultra-thin (0.1-0.4mm)Fits tight spaces
Polyimide coverlayFlexes without cracking
No vias in bend areasDFM review catches issues
Static or dynamic optimizedDesign support for your application
Prototype availableTest your bendable design
ISO9001 & UL certifiedQuality guaranteed

Order Process for Bendable Circuit Boards

  1. Upload Gerber files – specify bend type (static/dynamic), bend radius, thickness

  2. Free DFM review – we verify RA copper, bend radius, via placement

  3. Receive quotation – based on complexity

  4. First article (recommended) – 5-20 pieces for bend testing

  5. Production – built with RA copper and optimized stackup

  6. 100% electrical test – including continuity after bend (if specified)

  7. Secure shipping

Designing a bendable circuit? Contact us for engineering support. We help optimize bend radius, stackup, and material selection for your application.

Q1: What is the difference between a bendable circuit board and a rigid PCB?

A:

FeatureRigid PCBBendable Circuit Board
MaterialFR4 (thick, rigid)Polyimide (thin, flexible)
Thickness0.6-2.4mm0.1-0.4mm
BendabilityNone (cracks if bent)Yes – designed to bend
Copper typeED copperRA copper (bendable)

Bendable circuits are for applications that need to fit curved shapes or bending enclosures.


Q2: How many times can a bendable circuit board bend?

A: Depends on bend radius and copper type:

Bend Radius (vs. thickness)RA Copper (expected cycles)
30x thickness10,000-20,000 cycles
40x thickness30,000-50,000 cycles
50x thickness100,000+ cycles

Larger radius = longer life. For one-time assembly (static bend), radius can be smaller.


Q3: What is the minimum bend radius for a bendable circuit?

A:

Flex ThicknessStatic Bend (one-time)Dynamic Bend (repeated)
0.1mm1mm3mm
0.2mm2mm6mm
0.3mm3mm9mm
0.4mm4mm12mm

Rule of thumb: 10x thickness for static, 30x thickness for dynamic.


Q4: Can I put components on a bendable circuit board?

A: Yes – but with limitations.

Component TypeOn Bendable Area (no stiffener)On Stiffened Area
Small passives (0402, 0603)Yes (careful)Yes
Small ICs (SOIC, QFN)No (flex too thin)Yes (with stiffener)
ConnectorsNo (damages flex)Yes (with stiffener)
Battery, large ICsNoYes (with stiffener)

Best practice: Put components on stiffened areas. Use bendable areas only for interconnect.


Q5: Do you offer stiffeners for component areas on bendable circuits?

A: Yes – stiffeners add rigidity for component placement.

Stiffener TypeThicknessBest For
FR4 stiffener0.1-0.3mmZIF connectors, general support
Polyimide stiffener0.05-0.1mmThin applications
Metal stiffener0.1-0.2mmMechanical support, heat sinking

Stiffeners must be placed outside bend areas.


Q6: What is the thinnest bendable circuit board you can make?

A:

Layer CountMinimum Thickness
1 layer0.08mm (80µm) – available on request
2 layers0.1mm (100µm) – standard
4 layers0.3mm (300µm) – standard

For extreme thinness (0.08mm), contact us to confirm feasibility.


Q7: What coverlay color is available for bendable circuits?

A:

ColorAvailabilityBest For
YellowStandard – traditional FPC colorGeneral purpose
BlackStandardAesthetics, hiding traces
WhiteOn requestHigh contrast, medical

Yellow is traditional; black is popular for consumer-facing applications.


Q8: What is the typical lead time for bendable circuit boards?

A:

QuantityTypical Lead Time
Prototype (5-20 pieces)7-10 working days
Pilot (21-100 pieces)10-12 working days
Production (101-1,000+ pieces)12-15 working days

Quick turn available – contact us for urgent requirements.


Q9: What is the minimum order quantity?

A: No MOQ for prototypes – we accept as few as 5 pieces.

QuantityWe Accept
5-20 pieces (prototype)Yes
21-100 pieces (pilot)Yes
100+ pieces (production)Yes

Q10: How do I get started with a bendable circuit board design?

A: Recommended workflow:

  1. Calculate required bend radius – at least 10x thickness for static, 30x for dynamic

  2. Use RA copper – we provide as standard

  3. Avoid vias in bend area – keep ≥5mm away

  4. Place components on stiffened areas – not on bendable sections

  5. Send Gerber files – specify bend type and radius

  6. Free DFM review – we verify your design

  7. Order prototype (5-10 pieces) – test bending before mass production

We offer free DFM review for bendable circuit designs – we check bend radius, via placement, copper type, and stackup.

Shipping Terms

Shipping costs are paid by the buyer.
We normally ship via DHL, UPS, FedEx, or TNT.
Alternatively, you may provide your own courier account or arrange delivery to your freight forwarder in China.

For large-volume orders, sea freight is available.


Delivery to Port (FOB Terms)

When shipping to a port, Tengxinjie is responsible for transporting the goods to the departure port.
All customs clearance, ocean freight, insurance, and onward transportation after that point are the responsibility of the buyer.

Tengxinjie can recommend reliable local freight forwarders upon request.
With the buyer’s authorization, Tengxinjie may also assist in coordinating shipping, with all related costs charged to the buyer.


Notice

The above shipping information is for reference only.
Tracking details and shipment updates will be provided once the order has been dispatched.

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